Materials Science Forum October, 2003 Volumes 437 – 438 P.239-242
M.O. Lai and L. Lu
Thermal Conductivity, Thermo-Mechanical and Rheological Studies of Boron Nitride-Filled Polybutylene Terephthalate
Doi:
- DOI:
http://dx.doi.org/10.4028/www.scientific.net/MSF.437-438.239