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1Hydrometallurgy
Volume 3, Issue 2, March 1978, Pages 163-180

DOI:

http://dx.doi.org/10.1016/0304-386X(78)90018-X

The effects of kinetic variables on the structure of copper deposits cemented on pure aluminum discs: A scanning electron microscopic study
2)Electrochimica Acta
Volume 51, Issue 27, 25 August 2006, Pages 6111-6119
ChargeTransfer at Electrochemical Interfaces "Two Hundred Years of Electrlysis"

DOI:

http://dx.doi.org/doi:10.1016/j.electacta.2005.12.051

Effect of sulphuric acid and copper sulphate concentrations on the morphology of silver deposit in the cementation process\
3)Powder Technology
Volume 178, Issue 1, 5 September 2007, Pages 51-55

DOI:

http://dx.doi.org/doi:10.1016/j.powtec.2007.03.041

Preparation of silver powders in micron size from used photographic films via leaching–cementation technique
4)Hydrometallurgy
Volume 72, Issues 1-2, February 2004, Pages 93-110

DOI:

http://dx.doi.org/doi:10.1016/S0304-386X(03)00124-5

Study of the mechanism of silver ions cementation onto copper from acidic sulphate solutions and the morphology of the silver deposit
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