+++ Journal of Physics D: Applied Physics

[Tolstopuz]

Уважаемые колеги, помогите, пожалуйста со статьями:
1. T Kacsich, E Kolawa, J P Fleurial, T Caillat and M-A Nicolet.
Films of Ni-7 at% V, Pd, Pt and Ta-Si-N as diffusion barriers for copper on Bi2Te3.
Journal of Physics D: Applied Physics. Volume 31, Number 19.

DOI:

http://dx.doi.org/10.1088/0022-3727/31/19/007

2. Ka Xiong, Weichao Wang, Husam N Alshareef, Rahul P Gupta, John B White, Bruce E Gnade and Kyeongjae Cho.
Electronic structures and stability of Ni/Bi2Te3 and Co/Bi2Te3 interfaces .
Journal of Physics D: Applied Physics.
Volume 43, Number 11

DOI:

http://dx.doi.org/10.1088/0022-3727/43/11/115303

[suprachemister]

[Tolstopuz]

Спасибо огромное!!!