Доброго времени суток!
Помогите с поиском статей:
1) Electron microscopy study of nanocrystalline copper deformed by a microhardness indenter, Pratibha L. Gaia, Acta Materialia
- DOI:
http://dx.doi.org/10.1016/j.scriptamat.2006.08.057
2) D. B. Knorr and D. P. Tracy. A review of microstructure in vapor deposited copper thin films. Materials Chemistry and Physics, V. 41, Issue 3, 1995, P. 206-216.
- DOI:
http://dx.doi.org/10.1016/0254-0584(95)01515-9
3) Z. Shi, , G.R.G. Craib, M.A. Player and C.C. Tang. Texture development of evaporated nickel films on molybdenum substrates. Thin Solid Films, V. 304, Issues 1-2, 1997, P. 170-177
- DOI:
http://dx.doi.org/10.1016/S0040-6090(97)00110-7
4) Patten J.W. Columnar boundaries, diffusion and interfacial structure in sputtered metallic materials. Thin solid films. 54, 3, 1978, 325.
- DOI:
http://dx.doi.org/10.1016/0040-6090(78)90390-5
5) Dahlgren S. D., Nicholson W. L., Merz M. D., Bollmann Walter, Devlin J. F., Wang R. Microstructural analysis and tensile properties of thick copper and nickel sputter deposits. Thin solid films pp:345-353
- DOI:
http://dx.doi.org/10.1016/0040-6090(77)90136-5
6) K.S. Majumder. Synthesis and structural characterization of copper-alumina composites prepared by high rate physical vapor deposition. Thin Solid Films, Volume 40, January 1977, Page 247
- DOI:
http://dx.doi.org/10.1016/0040-6090(77)90368-6
7) K. S. Majumder. The structure-property relationships in evaporated thick films of alumina-dispersed copper. Thin Solid Films, Volume 42, Issue 3, 2 May 1977, Pages 343-352
- DOI:
http://dx.doi.org/10.1016/0040-6090(77)90369-8
Заранее благодарен.
