Low-pressure micro-silver sintering with the addition of indium for high-temperature power chips attachment
Chin-Hao Tsai, Wei-Chen Huang, Ly May Chew etc.
Journal of Materials Research and Technology
Volume 15, 2021, Pages 4541-4553
- DOI:
http://dx.doi.org/10.1016/j.jmrt.2021.10.079
Exploration of organic matrixes in conductive silver paste: a comprehensive review
Yang, J., Dong, H., Huang, Z. et al.
Journal of Materials Science: Materials in Electronics
2024, Volume 35, 1248
- DOI:
http://dx.doi.org/10.1007/s10854-024-13047-9
