Journal of Industrial and Engineering Chemistry
Volume 121, 25 May 2023, Pages 77-91
Y Lai, S Zhu, J Li, H Zhang, T Qi
One-step synthesis of micro-sized flake silver particles as
electrically conductive adhesive fillers in printed electronics
- DOI:
http://dx.doi.org/10.1016/j.jiec.2023.01.008
Materials Chemistry and Physics
Volume 297, 1 March 2023, 127399
E Wernicki, Y Shu, E Fratto, F Gao, G Morose
Preparation and characterization of nano-solder paste
with high nanoparticle loading and their thermal and printing properties
- DOI:
http://dx.doi.org/10.1016/j.matchemphys.2023.127399
2022 IEEE 24th Electronics Packaging Technology Conference (EPTC)
Date of Conference: 07-09 December 2022
Hakyung Jeong; Jae Hak Lee; Seung Man Kim; Ah-Young Park; Jun-Yeob Song
Hybrid Solder with silver hierarchical structure and particle
for Synergistic effect in shear strength of die attach behaviour
- DOI:
http://dx.doi.org/10.1109/EPTC56328.2022.10013199
