+++ J. Electron. Packag. +++

[tsarapoid]

Просьба скачать у кого есть доступ:


Performance of various fillers in adhesives applications: a review
Malav R. Sanghvi, Omkar H. Tambare & Aarti P. More 
Polymer Bulletin volume 79, pages 10491–10553 (2022)

DOI:

http://dx.doi.org/10.1007/s00289-021-04022-z

Conductive Materials for Printed Flexible Electronics
Colin Tong
Chapter 3
Part of the Springer Series in Materials Science book series (SSMATERIALS,volume 317)

DOI:

http://dx.doi.org/10.1007/978-3-030-79804-8_3

Joint Analysis and Reliability Test of Epoxy-Based Nano Silver Paste Under Different Pressure-Less Sintering Processes
Xinyue Wang, Zejun Zeng, Guoqi Zhang, Jing Zhang, Pan Liu
J. Electron. Packag. Dec 2022, 144(4): 041013

DOI:

http://dx.doi.org/10.1115/1.4053432

[Ol.Lo]

Добрый день!
1

Код: Выделить всё

https://drive.google.com/file/d/1qZVCKf2g9vSA1sRYNux75FYBjZ9R6pCX/view?usp=sharing

Chapter 3

Код: Выделить всё

https://drive.google.com/file/d/1Uq6Z8DGNNUW3GnUrmyvM_iPb0s4Zspjm/view?usp=sharing

[tsarapoid]

большое спасибо =)

[Oleg Tatarov]

Добрый день!

[tsarapoid]

спасибо большое =)