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Помогите пожалуйста со статьями:
1)The effect of the electrolyte on the structure of Cu---Cd alloys deposited onto the (111) plane of a copper single crystal
Thin Solid Films, Volume 87, Issue 1, 8 January 1982, Pages 23-28
E. gieka and A. Budniok

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http://dx.doi.org/10.1016/0040-6090(82)90566-1

2)Electrocrystallization of Cu-Cd alloys on the (111) plane of a copper single crystal
Surface Technology, Volume 14, Issue 2, October 1981, Pages 155-165
A. Budniok and E. giewka

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http://dx.doi.org/10.1016/0376-4583(81)90077-7

3)The influence of the type of electrolyte on the electrocrystallization of a Cu---Cd alloy on a single-crystal copper substrate
Thin Solid Films, Volume 82, Issue 2, 14 August 1981, Pages 127-141
A. Budniok

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http://dx.doi.org/10.1016/0040-6090(81)90436-3

4)The role of underpotential effects in the electrodeposition of alloys
Thin Solid Films, Volume 81, Issue 3, 24 July 1981, Pages 289-299
A. Budniok

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http://dx.doi.org/10.1016/0040-6090(81)90491-0

5)Underpotential effects in the process of electrodeposition of CuCd alloy on a Cu(111) single crystal
Journal of Electroanalytical Chemistry, Volume 123, Issue 2, 25 June 1981, Pages 365-372
A. Budniok

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http://dx.doi.org/10.1016/S0022-0728(81)80510-4

6)Electrodeposition of copper in the presence of cadmium
Electrochimica Acta, Volume 24, Issue 12, December 1979, Pages 1247-1252
A. Budniok, J. Gala and I. Pluta

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http://dx.doi.org/10.1016/0013-4686(79)87080-2

7)Small angle x-ray scattering studies of Cu-Cd alloys obtained using electrodeposition
Surface and Coatings Technology, Volume 27, Issue 4, April 1986, Pages 311-315
E. giewka and L. Paj k

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http://dx.doi.org/10.1016/0257-8972(86)90070-8

The structure of Cu---Cd alloys obtained electrolytically under galvanostatic conditions
Thin Solid Films, Volume 198, Issues 1-2, 20 March 1991, Pages 211-220
E. giewka and L. Paj k

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http://dx.doi.org/10.1016/0040-6090(91)90340-4

9)The formation of metal layers
Journal of Electroanalytical Chemistry, Volume 19, Issue 4, December 1968, Pages 325-334
D.J. Astley, J.A. Harrison and H.R. Thirsk

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http://dx.doi.org/10.1016/S0022-0728(68)80096-8

10)Formation of intermetallic phases during ageing of Zn electroplate on the Cu substrate
Applied Surface Science, Volume 229, Issues 1-4, 15 May 2004, Pages 402-408
Remigijus Ju k nas, V. Pak tas, A. Sudavi ius, V. Kapo ius and V. Karpavi ien

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http://dx.doi.org/10.1016/j.apsusc.2004.02.023

11)The effects of Copper---Zinc and Copper---Cadmium intermetallic compounds in different systems used for anodic stripping voltammetry
Analytica Chimica Acta, Volume 154, 1983, Pages 95-104
John A. Wise, Daryl A. Roston and William R. Heineman

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http://dx.doi.org/10.1016/0003-2670(83)80010-5

[Demcha]

1,3,4,5,6,7,9,10,11 +++

[Abwer]

1,2,8+++

[RadEl]

Demcha : Abwer - 9:3

[Abwer]

Demcha : Abwer - 9:3

[pel]

Спасибо большое за статьи! Очень нужны были!